Heat dissipation substrate ceramic-ceramic substrate-alumina ceramic
Focusing on the production of precision ceramics, exquisite craftsmanship, and support for customization.
1. Thermal conductivity > 170 W/m·k; it has thermal conductivity more than 7 times that of alumina and superior mechanical strength compared to alumina. 2. High electrical insulation, low dielectric constant, and low dielectric loss. 3. It has a thermal expansion coefficient close to silicon, achieving high reliability for mounting large silicon chips and thermal cycling. 4. It shows good corrosion resistance to molten metals. 5. It contains extremely low levels of impurities, is non-toxic, and has high purity. Product applications: Heat dissipation substrates, substrates for LED packages, substrates for semiconductors, thin-film circuit substrates, substrates for power resistors. Aluminum nitride ceramic substrates; Zirconia ceramic substrates; Silicon nitride ceramic substrates; Electrostatic chucks; Ceramic mechanical fingers; A manufacturer focusing on the research, development, and production of industrial precision ceramics and precision ceramics!
- 企業：ハポイン
- 価格：Other
